Abstract. A digital domain dynamic path accumulation method for a time-delay-integration (TDI) image sensor that can realize on-chip compensation for image distortion caused by sensor vibration is proposed. Through the proposed method, the exposure signals are controlled to enter the corresponding accumulator according to the vibration vector, ensuring the synchronous accumulation of different stages of pixels on the same object. The behavior level model of the method is established. The structural similarity (SSIM) between images without distortion, distorted images, and images compensated for by the proposed method is simulated and analyzed to verify the effectiveness of the method. Compared with conventional TDI, the SSIM between images with and without vibration is improved from 0.2322 to 0.9858, as the vibration level is 1 pixel per stage. With fixed TDI stages and the vibration level varying from 0 to 2 pixels per stage, the SSIM of conventional TDI drops rapidly to about 0.2 while that of the dynamic path accumulation method maintains at about 0.95. The proposed method is suitable for an antivibration CMOS-TDI image sensor of remote imaging systems.

中文翻译：

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CMOS时延积分图像传感器图像振动畸变补偿的数字域动态路径累加法

摘要。提出了一种用于时延积分(TDI)图像传感器的数字域动态路径累加方法，该方法可以实现对传感器振动引起的图像失真进行片上补偿。通过所提出的方法，根据振动矢量控制曝光信号进入相应的累加器，保证同一物体上不同阶段像素的同步累加。建立了该方法的行为级模型。对无畸变图像、畸变图像和经该方法补偿后的图像之间的结构相似性（SSIM）进行仿真分析，验证了该方法的有效性。与传统的TDI相比，有振动和无振动的图像之间的SSIM从0.2322提高到0.9858，因为振动水平为每阶段1个像素。在固定的TDI阶段和每阶段0到2个像素的振动水平变化的情况下，传统TDI的SSIM迅速下降到0.2左右，而动态路径累积方法的SSIM保持在0.95左右。所提出的方法适用于远程成像系统的抗振CMOS-TDI图像传感器。