当前位置: X-MOL 学术J. Microelectromech. Syst. › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
Comparison of Conventional and Maskless Lithographic Techniques for More than Moore Post-Processing of Foundry CMOS Chips
Journal of Microelectromechanical Systems ( IF 2.7 ) Pub Date : 2020-10-01 , DOI: 10.1109/jmems.2020.3015964
Andreas Tsiamis , Yifan Li , Camelia Dunare , Jamie R. K. Marland , Ewen O. Blair , Stewart Smith , Jonathan G. Terry , Srinjoy Mitra , Ian Underwood , Alan F. Murray , Anthony J. Walton

This article details and compares the technology options for post–processing foundry produced CMOS at chip-scale to enable More than Moore functionality. In many cases there are attractions in using chip-based processing through the Multi-Project Wafer route that is frequently employed in research, early-stage development and low-volume production. This article identifies that spray-based photoresist deposition combined with optical maskless lithography demonstrates sufficient performance combined with low cost and operational convenience to offer an attractive alternative to conventional optical lithography, where spin-coated photoresist is exposed through a patterned photomask. [2020-0249]

中文翻译:

代工CMOS芯片超摩尔后处理的传统和无掩模光刻技术比较

本文详细介绍并比较了后处理代工厂生产的芯片级 CMOS 的技术选项,以实现超越摩尔的功能。在许多情况下,通过多项目晶圆路线使用基于芯片的处理具有吸引力,该路线经常用于研究、早期开发和小批量生产。本文指出,基于喷涂的光刻胶沉积与光学无掩模光刻相结合,展示了足够的性能、低成本和操作便利性,为传统光学光刻提供了一种有吸引力的替代方案,其中旋涂光刻胶通过图案化光掩模曝光。[2020-0249]
更新日期:2020-10-01
down
wechat
bug