Bonding wires are widely used in microwave circuits and chip packaging. The exposure to harsh environments may lead to connection failure in these wires. In this article, the impact of such failures on signal transmission was studied using model analysis and experimental testing. The effects of gold bonding wire failure on both the dc and high frequency characteristics were analyzed. Signal reflection and loss caused by failed gold bonding wire at different positions and a number of failed gold bonding wire were also investigated. Based on computational electromagnetics and transmission line theory, a 3-D electromagnetic field numerical calculation model and a distributed parameter circuit model were developed. The electromagnetic field model results are in good agreements with those obtained from the distributed parameter circuit model. The results obtained by the model simulation are validated using experimental tests. The results of this investigation provide a better understanding of the influence of the position and the number of failed bonding wires on the signal integrity of the circuit and theoretical support for identifying failure features in fault diagnosis.

中文翻译：

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键合线连接故障对射频电路信号传输的影响

键合线广泛用于微波电路和芯片封装。暴露在恶劣的环境中可能会导致这些电线的连接失败。在本文中，使用模型分析和实验测试研究了此类故障对信号传输的影响。分析了金键合引线故障对直流和高频特性的影响。还研究了金键合引线在不同位置和许多金键合引线失效引起的信号反射和损耗。基于计算电磁学和传输线理论，建立了三维电磁场数值计算模型和分布参数电路模型。电磁场模型的结果与从分布式参数电路模型获得的结果吻合良好。通过模型仿真获得的结果使用实验测试进行了验证。这项研究的结果可以更好地理解位置和失效键合线的数量对电路信号完整性的影响，并为在故障诊断中识别失效特征提供理论支持。