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Development of Thermal Conductive tpPI/Oriented h‐BN Insulating Composite Material Using the Electrostatic Adsorption Method
IEEJ Transactions on Electrical and Electronic Engineering ( IF 1 ) Pub Date : 2020-10-05 , DOI: 10.1002/tee.23228
Yoshinobu Murakami 1 , Norikazu Hamasaki 1 , Akio Kikuike 1 , Tomohiro Kawashima 1 , Naohiro Hozumi 1
Affiliation  

A thermal conductive plate in a device like a power module for an automobile requires materials with high thermal conductivity, acceptable electric breakdown strength, and high thermal stability. Thermoplastic polyimide (tpPI)/oriented hexagonal boron nitride (h‐BN) composite materials are produced by an electrostatic adsorption method. The tpPI/oriented h‐BN composite shows high thermal properties (glass transition temperature of about 240 °C and a thermal conductivity of 10 W/mK or more, so on.) In addition, the direct current breakdown strength exceeds 150 kV/mm. It is cleared that the tpPI/oriented h‐BN composite exhibits an acceptable breakdown strength, high thermal conductivity, and high thermal stability. © 2020 Institute of Electrical Engineers of Japan. Published by Wiley Periodicals LLC.

中文翻译:

使用静电吸附法开发导热tpPI /定向h-BN绝缘复合材料

在诸如汽车的功率模块的装置中的导热板需要具有高导热率,可接受的击穿强度和高热稳定性的材料。热塑性聚酰亚胺(tpPI)/定向六方氮化硼(h-BN)复合材料是通过静电吸附方法生产的。tpPI /取向的h-BN复合材料显示出高的热性能(玻璃化转变温度约为240°C,热导率达到10 W / mK或更高,依此类推。)此外,直流击穿强度超过150 kV / mm 。很明显,tpPI /取向的h-BN复合材料表现出可接受的击穿强度,高导热率和高热稳定性。©2020日本电气工程师学会。由Wiley Periodicals LLC发布。
更新日期:2020-10-26
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