A paste of copper microparticles, formic acid, and octylamine was developed to produce thick copper films with a stable shape and low electrical resistivity via low-temperature calcination. This study examined (1) the effect of cleaning the copper microparticle surface with formic acid, (2) the effect of calcination temperature, and (3) the effect that the addition of amine exerted on volume resistivity and on the shape of the copper film. The volume resistivities of the thick copper film were measured using a 4-point probe method. The thickness and shape of the copper film was observed via FE-SEM using an optical microscope.

中文翻译：

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通过可印刷电子产品的铜微粒的低温热分解，形成稳定的铜膜形状

开发了铜微粒，甲酸和辛胺的浆料，通过低温煅烧生产出具有稳定形状和低电阻率的厚铜膜。这项研究检查了（1）用甲酸清洁铜微粒表面的效果，（2）煅烧温度的效果，以及（3）添加胺对体积电阻率和铜膜形状的影响。使用四点探针法测量厚铜膜的体积电阻率。使用光学显微镜通过FE-SEM观察铜膜的厚度和形状。