Stencil contact printing is widely used to fabricate conductive patterns, and it is particularly used with solder paste to create interconnections. However, stencil contact printing is becoming inefficient for electronic components owing to the ever decreasing size of the components. An alternative method for fine pattern formation is screen printing, i.e. gap printing with a screen mask, which exploits the thixotropic characteristics of solder paste. Nevertheless, the mesh of the screen mask prevents the paste from permeating, resulting in irregular patterns. To address this issue, we propose gap printing with a mesh-cut screen mask. In this paper, we describe the fabrication procedure of the mask, and demonstrate the effectiveness of the proposed printing in the formation of fine and thick circular patterns; the patterns are shown to have low variations in size compared with conventional printing methods. The proposed method is expected to contribute to the further miniaturisa...

中文翻译：

---

使用丝网印刷的不锈钢网状丝网掩膜，通过焊锡膏形成精细的图案

模板接触印刷被广泛用于制造导电图案，特别是与焊膏一起使用以形成互连。然而，由于部件的尺寸不断减小，模版接触印刷对于电子部件而言变得效率低下。精细图案形成的另一种方法是丝网印刷，即利用丝网掩膜进行间隙印刷，它利用了焊膏的触变特性。尽管如此，丝网掩膜的网孔仍可防止糊剂渗透，从而导致图案不规则。为解决此问题，我们建议使用网眼切割的丝网掩模进行间隙印刷。在本文中，我们描述了掩模的制造过程，并论证了所提出的印刷在形成精细和厚圆形图案方面的有效性；与常规印刷方法相比，该图案的尺寸变化较小。预期所提出的方法将有助于进一步的小型化。