In this study, the effect of Scanning Electron Microscopy (SEM) parameters such as magnification (M), accelerating voltage (V), and working distance (WD) on the 3D digital reconstruction technique, as the first step of the quantitative characterization of fracture surfaces with SEM, was investigated. The 2D images were taken via a 4-Quadrant Backscattered Electron (4Q-BSE) detector. In this study, spherical particles of Ti-6Al-4V (15-45 μm) deposited on the silicon substrate were used. It was observed that the working distance has a significant influence on the 3D digital rebuilding method via SEM images. The results showed that the best range of the working distance for our system is 9 to 10 mm. It was shown that by increasing the magnification to 1000x, the 3D digital reconstruction results improved. However, there was no significant improvement by increasing the magnification beyond 1000x. In addition, results demonstrated that the lower the accelerating voltage, the higher the precision of the 3D reconstruction technique, as long as there are clean backscattered signals. The optimal condition was achieved when magnification, accelerating voltage, and working distance were chosen as 1000x, 3 kV, and 9 mm, respectively.

中文翻译：

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放大倍数、加速电压和工作距离对 3D 数字重建技术的影响研究

在这项研究中，扫描电子显微镜 (SEM) 参数如放大率 (M)、加速电压 (V) 和工作距离 (WD) 对 3D 数字重建技术的影响，作为裂缝定量表征的第一步用 SEM 对表面进行了研究。二维图像是通过四象限背散射电子 (4Q-BSE) 探测器拍摄的。在这项研究中，使用沉积在硅基板上的 Ti-6Al-4V（15-45 μm）球形颗粒。通过 SEM 图像观察到工作距离对 3D 数字重建方法有显着影响。结果表明，我们系统的最佳工作距离范围是 9 到 10 毫米。结果表明，通过将放大倍数增加到 1000 倍，3D 数字重建结果有所改善。然而，将放大倍数提高到 1000 倍以上并没有显着改善。此外，结果表明，只要有干净的反向散射信号，加速电压越低，3D 重建技术的精度就越高。当放大倍数、加速电压和工作距离分别选择为 1000x、3 kV 和 9 mm 时，达到最佳条件。