Advances in materials and mechanics designs have led to the development of flexible electronics, which have important applications to human healthcare due to their good biocompatibility and conformal integration with biological tissue. Material innovation and mechanics design have played a key role in designing the substrates and encapsulations of flexible electronics for various bio-integrated systems. This review first introduces the inorganic materials and novel organic materials used for the substrates and encapsulation of flexible electronics, and summarizes their mechanics properties, permeability and optical transmission properties. The structural designs of the substrates are then introduced to ensure the reliability of flexible electronics, including the patterned and pre-strained designs to improve the stretchability, and the strain-isolation and -limiting substrates to reduce the deformation. Some emerging encapsulations are presented to protect the flexible electronics from degradation, environmental erosion or contamination, though they may slightly reduce the stretchability of flexible electronics.

中文翻译：

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柔性电子基板和封装的材料创新和力学设计：综述

材料和机械设计的进步导致了柔性电子产品的发展，由于其良好的生物相容性和与生物组织的保形整合，它们在人类医疗保健中具有重要的应用。材料创新和力学设计在为各种生物集成系统设计柔性电子器件的基板和封装方面发挥了关键作用。本文首先介绍了用于柔性电子基板和封装的无机材料和新型有机材料，并总结了它们的力学性能、磁导率和光传输性能。然后引入基板的结构设计以确保柔性电子产品的可靠性，包括图案化和预应变设计以提高可拉伸性，以及应变隔离和限制基板以减少变形。一些新兴的封装被提出来保护柔性电子产品免受退化、环境侵蚀或污染，尽管它们可能会略微降低柔性电子产品的可拉伸性。