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Stress relaxation properties of an epoxy-based shape-memory polymer considering temperature influence: experimental investigation and constitutive modeling
Mechanics of Time-Dependent Materials ( IF 2.5 ) Pub Date : 2019-07-04 , DOI: 10.1007/s11043-019-09420-5
Pengxuan Fan , Wujun Chen , Jianhui Hu , Bing Zhao , Jifeng Gao , Guangqiang Fang , Fujun Peng

Epoxy-based shape-memory polymer (ESMP), belonging to viscoelastic thermosets, exhibits strong temperature-dependent relaxation property caused by the glass transition process. Thoroughly experimental investigation and accurate numerical prediction are indispensable to be performed in the structures that demand for high precise structural controls. In this work, key parameters of an ESMP in stress relaxation process including initial modulus, elastic modulus, viscous modulus and relaxation time were experimentally investigated and constitutive-model-based analyzed to study the influence of the temperature, where the constitutive model was established by modifying the constant parameters of a neo-Hookean hyper-viscoelastic model to be functions of the temperature. A numerical simulation method was developed by coding UMAT in ABAQUS using the constitutive model and was verified by finite element simulations of stress relaxation experiments. The maximum deviation of 4.5% between simulations and experiments indicated the reasonability of the model in depicting stress relaxation process considering the influence of the temperature.



中文翻译:

考虑温度影响的基于环氧的形状记忆聚合物的应力松弛特性:实验研究和本构模型

属于粘弹性热固性材料的基于环氧树脂的形状记忆聚合物(ESMP)表现出由玻璃化转变过程引起的强烈的随温度变化的松弛特性。在需要高精度结构控制的结构中,进行彻底的实验研究和准确的数值预测是必不可少的。在这项工作中,实验研究了应力松弛过程中ESMP的关键参数,包括初始模量,弹性模量,粘滞模量和弛豫时间,并基于本构模型分析了温度的影响,并由此建立了本构模型。将新霍克超粘弹性模型的常数参数修改为温度的函数。通过使用本构模型在ABAQUS中对UMAT进行编码,开发了一种数值模拟方法,并通过应力松弛实验的有限元模拟进行了验证。模拟和实验之间的最大偏差为4.5%,表明模型在考虑温度影响的应力松弛过程中的合理性。

更新日期:2019-07-04
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