Abstract The beneficial effects of Mo on passive film formation were investigated for Ni22Cr10Mo with AESEC and XPS by comparison with Ni22Cr and pure Ni and Mo. Both spontaneous (E ≈ -0.2 VSCE) and anodic passivation (E = 0.3 VSCE) showed Cr surface accumulation, while significant Mo accumulation (as Mo(IV)) only occurred during spontaneous passivation with a markedly reduced open circuit corrosion rate as a consequence. Mo facilitated the active to passive transition in the low potential domain probably by favoring the oxidation of Cr to Cr2O3 over Cr(OH)3. At higher potential, Mo dissolved as Mo(VI) and did not accumulate in the film.

中文翻译：

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Cr和Mo对Ni22Cr和Ni22Cr10Mo合金在硫酸中钝化的贡献

摘要 通过与 Ni22Cr 和纯 Ni 和 Mo 的比较，用 AESEC 和 XPS 研究了 Mo 对 Ni22Cr10Mo 钝化膜形成的有益影响。自发钝化 (E ≈ -0.2 VSCE) 和阳极钝化 (E = 0.3 VSCE) 均显示出 Cr 表面积累，而显着的 Mo 积累（如 Mo（IV））仅在自发钝化期间发生，因此开路腐蚀速率显着降低。Mo 可能通过促进 Cr 氧化成 Cr2O3 而不是 Cr(OH)3 来促进低电位域中的主动到被动转变。在更高的电位下，Mo 溶解为 Mo(VI) 并且不会在膜中积累。