Tin–silver–copper (SAC) solder alloys are the most promising candidates to replace Sn–Pb solder alloys. However, their application is still facing several challenges; one example is the electrochemical corrosion behaviour, which imposes a risk to electronics reliability. Numerous investigations have been carried out to evaluate the corrosion performance of SAC lead-free alloys, regarding the effect of the corrosive environment, the different manufacturing technologies, the effect of fluxes, the metallic contents within the SAC alloys themselves, and the different alloying elements. In these studies, widely used electrochemical techniques are applied as accelerated corrosion tests, such as linear sweep voltammetry and electrochemical impedance spectroscopy. However, there is lack of studies that try to summarise the various corrosion results in terms of lead-free solder alloys including low-Ag and composite solders. This study aims to review these studies by showing the most important highlights regarding the corrosion processes and the possible future developments.

中文翻译：

---

SAC合金的电化学腐蚀研究进展

锡-银-铜（SAC）焊料合金是替代Sn-Pb焊料合金的最有希望的候选者。但是，它们的应用仍然面临着一些挑战。一个例子是电化学腐蚀行为，这会对电子可靠性造成威胁。已经进行了许多研究以评估SAC无铅合金的腐蚀性能，涉及腐蚀环境的影响，不同的制造技术，助熔剂的影响，SAC合金自身内部的金属含量以及不同的合金元素。在这些研究中，广泛使用的电化学技术被用作加速腐蚀测试，例如线性扫描伏安法和电化学阻抗谱。然而，缺乏研究试图总结包括无铅焊料和复合焊料在内的无铅焊料合金的各种腐蚀结果。这项研究旨在通过显示有关腐蚀过程和可能的未来发展的最重要亮点来回顾这些研究。