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Microstructure and mechanical behavior of TiO2‐MnO‐doped alumina/alumina laminates
Journal of the American Ceramic Society ( IF 3.9 ) Pub Date : 2020-09-22 , DOI: 10.1111/jace.17490
Marcelo Daniel Barros 1, 2 , Hans Jelitto 2 , Dachamir Hotza 1 , Rolf Janssen 2
Affiliation  

Tapes of TiO2‐MnO‐doped alumina (d‐Al2O3) and pure alumina (Al2O3) were shaped via tape casting. Laminates with three different layer numbers and respective thicknesses were produced and sintered at 1200°C. The microstructure and mechanical behavior of laminates were investigated and compared to the respective monolithic references (d‐Al2O3 and Al2O3). The use of dopants in alumina decreased the initial sintering temperature, leading to higher densification at 1200°C (~98% theoretical density (TD)) when compared to Al2O3 (~73% TD). The higher density was reflected in a higher Young's modulus and hardness for doped alumina. A region of diffusion of dopants in pure alumina layers was observed along the interface with doped layers. The mechanical strength of d‐Al2O3 samples sintered at 1200°C was not statistically different from Al2O3 samples sintered at 1350°C. The strength of laminates composed of doped layers with undoped, porous interlayers did not change. Nevertheless, as the thickness of these porous interlayers increases, a loss of strength was observed. Monolithic references showed constant values of fracture toughness (KIC), ~2 MPa·m1/2, and linear crack path. On the other hand, KIC of laminates increases when the crack propagates from weak Al2O3 layers to dense d‐Al2O3 layers.

中文翻译:

掺杂TiO2-MnO的氧化铝/氧化铝层压板的微观结构和力学行为

TiO 2 -MnO掺杂的氧化铝(d-Al 2 O 3)和纯氧化铝(Al 2 O 3)的带材通过流延成型。生产具有三种不同层数和各自厚度的层压板,并在1200℃下烧结。研究了层压板的微观结构和力学行为,并将其与相应的整体式参考材料(d-Al 2 O 3和Al 2 O 3)进行了比较。与Al 2 O 3相比,在氧化铝中使用掺杂剂降低了初始烧结温度,从而导致在1200°C下具有更高的致密化(〜98%理论密度(TD))。(〜73%TD)。较高的密度反映出掺杂氧化铝的较高杨氏模量和硬度。沿着与掺杂层的界面观察到纯氧化铝层中掺杂剂的扩散区域。在1200°C下烧结的d-Al 2 O 3样品的机械强度与在1350°C下烧结的Al 2 O 3样品在统计学上没有差异。由具有未掺杂的多孔中间层的掺杂层组成的层压板的强度没有变化。然而,随着这些多孔中间层的厚度增加,观察到强度损失。整体参考显示出恒定的断裂韧性(K IC)值,〜2 MPa·m 1/2和线性裂纹路径。另一方面,K当裂纹从弱的Al 2 O 3层扩展到致密的d-Al 2 O 3层时,层压板的IC会增加。
更新日期:2020-09-22
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