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Simulating and Ensuring the Reliability of the Elements and Joints of Three-Dimensional Microelectronics Modules
Russian Microelectronics Pub Date : 2020-03-10 , DOI: 10.1134/s1063739719070114
A. I. Pogalov , G. A. Blinov , E. Y. Chugunov

Abstract

In order to ensure the operability, durability, and reliability of three-dimensional microelectronic modules, the engineering calculation of the structures, including the simulation of adhesive-bonded joints, as well as a valid choice of materials and constructive decisions, is necessary. The main operational and physical specifications for three-dimensional microelectronic modules and the advantages of the application of adhesive materials in the structures of modules are presented. It is established that the structural strength of three-dimensional microelectronic modules and the operating characteristics of adhesive-bonded joints depend on many factors. The most important factors among them are the properties of the adhesive material, the structure of the joints and the operating conditions. The types of loads, which affect the modules during their operation and their influence on the structural strength are considered. It is revealed that irregular loads, such as peeling and bending, are the most dangerous loading types for the adhesive-bonded joints of modules. It is established that in peeling a high concentration of edge stresses arises, which leads to the destruction of the joints, and in bending there is a concentration of normal and tangential stresses along the length of the glue lines. The types of adhesive materials which are used for assembling the modules are analyzed. The adhesive materials are selected taking the main design and technological constraints and the requirements on adhesive-bonded joints into account. The module’s structures are simulated and the influence of the physical, mechanical, and thermal properties of the adhesive materials on the stresses in the adhesive-bonded joints and the strength of the products under the impact of inertial loads with an acceleration of 1000g and heated by 40°С is determined. Recommendations on the simulation of adhesive-bonded joints of three-dimensional microelectronic modules are made. The obtained results revealed that the stresses depend on the elastic properties of the adhesive-bonded joints, as well as on the nature and value of the load on them, and they are determined by the mechanical strength and rigidity of the adhesive material. In order to reduce the stresses, it is necessary to use more rigid structural materials, and the adhesive materials need to be chosen based on the operating conditions of the microelectronic module.


中文翻译:

模拟和确保三维微电子模块的元素和接头的可靠性

摘要

为了确保三维微电子模块的可操作性,耐用性和可靠性,必须对结构进行工程计算,包括模拟粘合连接,以及有效选择材料和建设性决策。介绍了三维微电子模块的主要操作和物理规格,以及在模块结构中应用粘合材料的优势。已经确定,三维微电子模块的结构强度和胶接接头的工作特性取决于许多因素。其中最重要的因素是粘合材料的性质,接头的结构和工作条件。负载类型 考虑在模块运行期间会影响模块的强度及其对结构强度的影响。结果表明,不规则负载(例如,剥离和弯曲)是模块粘合接头最危险的负载类型。可以确定的是,在剥离时会产生高浓度的边缘应力,这会导致接头的破坏,而在弯曲时会沿胶线的长度产生一定的法向应力和切向应力。分析了用于组装模块的粘合材料的类型。选择粘合剂材料时要考虑主要的设计和技术限制以及对粘合接头的要求。模拟了模块的结构,并对物理,机械,确定g并加热40°С。提出了关于模拟三维微电子模块的胶接接头的建议。所获得的结果表明,应力取决于粘合接头的弹性特性,还取决于它们的载荷性质和值,应力取决于粘合材料的机械强度和刚度。为了减小应力,需要使用更刚性的结构材料,并且需要根据微电子模块的操作条件来选择粘合材料。
更新日期:2020-03-10
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