Molding compounds (MCs) are widely used as an encapsulation material for integrated circuits; however, traditional MCs are susceptible to moisture and charge spreading over time. The increase in dissipation factor due to the increase of parasitic electrical conductivity ( $\sigma$ ) and the decrease in dielectric strength $(E_{\mathrm {MC}}^{\mathrm {Crit}})$ restrict their applications. Thus, a fundamental understanding of moisture transport as a function of MC parameters is essential to suppress moisture diffusion and broaden their applications. In this article, we: 1) propose a generalized effective medium and solubility (GEMS) Langmuir model by identifying a set of parameters that control water uptake as a function of filler configuration and relative humidity; 2) investigate the dominant impact of reacted-water on $\sigma $ through numerical simulations, mass-uptake, and dc conductivity measurements; 3) investigate electric field distribution to explain how moisture ingress reduces $E_{\mathrm {MC}}^{\mathrm {Crit}}$ ; and finally 4) optimize the filler configuration to lower the dissipation factor, and enhance $E_{\mathrm {MC}}^{\mathrm {Crit}}$ . The GEMS-Langmuir model can be used for any application (e.g., photovoltaics, biosensors) where moisture ingress leads to reliability challenges.

中文翻译：

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填料形态和水分对HV-ICs封装用环氧树脂复合材料的耗散因数和临界电场的影响

模塑料（MCs）被广泛用作集成电路的封装材料。但是，传统的MC易受潮气和电荷随时间扩散的影响。耗散因数的增加归因于寄生电导率的增加（ $ \ sigma $ ）并降低绝缘强度 $（E _ {\ mathrm {MC}} ^ {\ mathrm {Crit}}）$ 限制其应用。因此，对水分传输作为MC参数的函数的基本了解对于抑制水分扩散和扩大其应用至关重要。在本文中，我们：1）通过确定一组参数来控制广义水的有效介质和溶解度（GEMS）Langmuir模型，该参数控制吸水率与填料构型和相对湿度之间的关系；2）研究反应水对水的主要影响 $ \ sigma $ 通过数值模拟，质量吸收和直流电导率测量；3）研究电场分布以解释水分减少的方式 $ E _ {\ mathrm {MC}} ^ {\ mathrm {Crit}} $ ; 最后4）优化填充物配置，以降低耗散系数并增强 $ E _ {\ mathrm {MC}} ^ {\ mathrm {Crit}} $ 。GEMS-Langmuir模型可用于水分进入导致可靠性挑战的任何应用（例如，光伏，生物传感器）。