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Surface Quality Improvement of 3D Microstructures Fabricated by Micro-EDM with a Composite 3D Microelectrode.
Micromachines ( IF 3.4 ) Pub Date : 2020-09-19 , DOI: 10.3390/mi11090868
Jianguo Lei 1 , Kai Jiang 1 , Xiaoyu Wu 1 , Hang Zhao 1 , Bin Xu 1
Affiliation  

Three-dimensional (3D) microelectrodes used for processing 3D microstructures in micro-electrical discharge machining (micro-EDM) can be readily prepared by laminated object manufacturing (LOM). However, the microelectrode surface always appears with steps due to the theoretical error of LOM, significantly reducing the surface quality of 3D microstructures machined by micro-EDM with the microelectrode. To address the problem above, this paper proposes a filling method to fabricate a composite 3D microelectrode and applies it in micro-EDM for processing 3D microstructures without steps. The effect of bonding temperature and Sn film thickness on the steps is investigated in detail. Meanwhile, the distribution of Cu and Sn elements in the matrix and the steps is analyzed by the energy dispersive X-ray spectrometer. Experimental results show that when the Sn layer thickness on the interface is 8 μm, 15 h after heat preservation under 950 °C, the composite 3D microelectrodes without the steps on the surface were successfully fabricated, while Sn and Cu elements were evenly distributed in the microelectrodes. Finally, the composite 3D microelectrodes were applied in micro-EDM. Furthermore, 3D microstructures without steps on the surface were obtained. This study verifies the feasibility of machining 3D microstructures without steps by micro-EDM with a composite 3D microelectrode fabricated via the proposed method.

中文翻译:

带有复合3D微电极的Micro-EDM制造的3D微结构的表面质量改善。

通过层压物体制造(LOM)可以很容易地制备用于在微电火花加工(micro-EDM)中处理3D微观结构的三维(3D)微电极。但是,由于LOM的理论误差,微电极表面总是阶梯状出现,从而显着降低了用微电极进行微EDM加工的3D微结构的表面质量。为了解决上述问题,本文提出了一种填充方法来制造复合3D微电极,并将其应用于微型EDM中以无步骤地处理3D微结构。详细研究了键合温度和锡膜厚度对步骤的影响。同时,利用能量色散X射线能谱仪分析了Cu和Sn元素在基体和台阶中的分布。实验结果表明,在950°C保温15 h后,当界面上的Sn层厚度为8μm时,成功制备了表面无台阶的复合3D微电极,而Sn和Cu元素均匀分布在表面微电极。最后,将复合3D微电极应用于微型EDM。此外,获得了在表面上没有台阶的3D微结构。这项研究验证了通过建议的方法制造的带有复合3D微电极的微型EDM无需阶梯式加工3D微结构的可行性。Sn和Cu元素均匀分布在微电极中。最后,将复合3D微电极应用于微型EDM。此外,获得了在表面上没有台阶的3D微结构。这项研究验证了通过建议的方法制造的带有复合3D微电极的微型EDM无需阶梯式加工3D微结构的可行性。Sn和Cu元素均匀分布在微电极中。最后,将复合3D微电极应用于微型EDM。此外,获得了在表面上没有台阶的3D微结构。这项研究验证了通过建议的方法制造的带有复合3D微电极的微型EDM无需阶梯式加工3D微结构的可行性。
更新日期:2020-09-20
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