Abstract Ag–Sb alloys are promising materials in joining applications and Cu is frequently encountered in electronic and thermoelectric devices. This study examines the Ag-41.0 at%Sb/Cu interfacial reactions and the phase equilibria isothermal sections of Ag–Cu–Sb at 300 °C and 500 °C. The Ag–Sb eutectic is reexamined and is at Ag-42.0 at%Sb and at 484.5 °C. No ternary compound is observed in the Ag–Cu–Sb system. It is found the ternary solubilities in the binary compounds in the Ag–Cu–Sb system are not significant. The highest is 4.7 at.% Cu in the Ag7Sb compound. Two reaction phases, Cu2Sb and Ag3Sb, are formed in the Ag–Sb/Cu couples reacted at 300 °C. Three reaction phases, Cu2Sb, Cu3Sb and Ag3Sb, are formed in the Ag–Sb/Cu couples reacted at 500 °C. The reaction rate in the couples reacted at 500 °C is very fast, and the reaction layer is 89 μm thick in the couple reacted for 4 min.

中文翻译：

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Ag-Sb/Cu 界面反应和 Ag-Cu-Sb 相平衡

摘要 Ag-Sb 合金是连接应用中很有前途的材料，而 Cu 经常用于电子和热电设备中。本研究检查了 Ag-41.0 at%Sb/Cu 界面反应和 Ag-Cu-Sb 在 300 °C 和 500 °C 下的相平衡等温截面。重新检查 Ag-Sb 共晶物，其浓度为 Ag-42.0 at%Sb，温度为 484.5 °C。在 Ag-Cu-Sb 系统中没有观察到三元化合物。发现 Ag-Cu-Sb 体系中二元化合物的三元溶解度不显着。最高的是 Ag7Sb 化合物中 4.7 at.% 的 Cu。在 300 °C 反应的 Ag-Sb/Cu 对中形成两个反应相，Cu2Sb 和 Ag3Sb。三个反应相，Cu2Sb、Cu3Sb 和 Ag3Sb，在 500 °C 反应的 Ag-Sb/Cu 对中形成。500℃反应的情侣反应速度非常快，