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Fabrication and characterization of the Mo/cu bimetal with thick Mo layer and high interfacial strength
International Journal of Refractory Metals & Hard Materials ( IF 3.6 ) Pub Date : 2020-09-18 , DOI: 10.1016/j.ijrmhm.2020.105383
Kaiyuan Liu , Pengwan Chen , Jianrui Feng , Chun Ran , Yuanjing Wang , Qiang Zhou , Lei Zhu

Due to the brittleness of molybdenum (Mo) and high difference in melting point, it is still a challenge to clad thick Mo onto copper (Cu) with high quality bonding. In this study, a 5 mm thick Mo plate was successfully welded with Cu plate by hot explosive welding, without any cracks being formed. The maximum shear strength of the interface exceeded 295 MPa. The calculated weldability window indicated that the welding was achieved with the parameters close to the lower boundary, and successfully predicted the wavy interfaces. The interfacial microstructures were investigated by scanning electron microscope, electron backscatter diffraction and transmission electron microscopy, the results showed that the dislocations in Cu were higher than the Mo side and the evolutions of interfacial structure due to severe deformation, such as misorientation angle, recrystallization and texture, were quite different for Mo and Cu.



中文翻译:

具有厚Mo层和高界面强度的Mo / cu双金属的制备与表征

由于钼(Mo)的脆性和熔点的高差异,以高质量的键合将厚Mo覆盖在铜(Cu)上仍然是一个挑战。在这项研究中,通过热爆炸焊接成功地将5 mm厚的Mo板与Cu板焊接在一起,而没有形成裂纹。界面的最大剪切强度超过295 MPa。计算得出的可焊性窗口表明,在参数接近下边界的情况下完成了焊接,并成功地预测了波状界面。通过扫描电子显微镜,电子背散射衍射和透射电子显微镜对界面微观结构进行了研究,结果表明,Cu的位错高于Mo侧,并且由于严重变形导致界面结构的演变,

更新日期:2020-09-23
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