ABSTRACT High-speed attachment of dies on an Ag finish was demonstrated through pressure-assisted sinter-bonding at temperatures <250°C using 2 μm Cu particles coated with Ag, to achieve a high-temperature sustainable bondline. The Ag shells were dewetted by instability at the Ag layer/Cu core interface during heating, which initiated the sinter-bonding. Consequently, in the case where Ag coating content was 20 wt-%, sufficient shear strengths of 24.6 and 34.1 MPa were measured even after an extremely short bonding time of just 1 min, at 220 and 250°C, respectively. When Ag coating content was increased to 40 wt-%, high shear strengths of 29.5–30.5 and 35.6–36.3 MPa were measured after ultra-rapid bonding for 0.5–1 min at 220 and 250°C, respectively. Furthermore, near-full-density bondlines could be achieved through a nano-volcanic eruption behaviour after a relatively short bonding time of 5 min at both 220 and 250°C.

中文翻译：

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使用涂有银的 2 µm Cu 颗粒在 250°C 以下的烧结粘合中高速形成接近全密度的粘合层

摘要 通过压力辅助烧结结合，使用涂有 Ag 的 2 μm Cu 颗粒，在 <250°C 的温度下，证明了芯片在 Ag 表面上的高速附着，以实现高温可持续的粘合层。银壳在加热过程中因银层/铜核界面的不稳定性而去湿，这引发了烧结。因此，在 Ag 涂层含量为 20 重量％的情况下，即使在 220 和 250°C 的极短结合时间后，也分别测量到 24.6 和 34.1 MPa 的剪切强度。当 Ag 涂层含量增加到 40 wt-% 时，分别在 220 和 250°C 下超快速键合 0.5-1 分钟后测量到 29.5-30.5 和 35.6-36.3 MPa 的高剪切强度。此外，