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Self‐Assemby: Wafer‐Scale High‐Quality Microtubular Devices Fabricated via Dry‐Etching for Optical and Microelectronic Applications (Adv. Mater. 37/2020)
Advanced Materials ( IF 29.4 ) Pub Date : 2020-09-15 , DOI: 10.1002/adma.202070281
Christian N. Saggau 1 , Felix Gabler 1, 2 , Dmitriy D. Karnaushenko 1 , Daniil Karnaushenko 1 , Libo Ma 1 , Oliver G. Schmidt 1, 2, 3
Affiliation  

In article number 2003252, Libo Ma, Oliver G. Schmidt, and co‐workers develop a dry‐release approach for the rolling up of strained nanomembranes, for the fabrication of electronic and optical devices. This approach results in in high yield, reproducibility, and uniformity, and represents a major step toward wafer‐scale integration of microdevices.
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中文翻译:

自组装:通过干蚀刻制造的晶圆级高质量微管器件,用于光学和微电子应用(Adv。Mater。37/2020)

Libo Ma,Oliver G. Schmidt及其同事在编号为2003252的文章中开发了一种干式释放方法,用于卷绕应变的纳米膜,用于制造电子和光学设备。这种方法可实现高产量,可重复性和均匀性,是朝着微器件晶圆级集成迈出的重要一步。
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更新日期:2020-09-15
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