Selection of proper phase‐change material (PCM) plays a crucial role in the development of latent heat thermal management module. Very often, selection of improper material leads to early failure of the product which results in huge economic loss. Most of the researchers utilize PCM in a particular application based on their experience and availability. The designer needs to consider all possible alternatives and evaluate in terms of various conflicting criteria or attributes. The optimal selection of PCM for a particular application is a multi‐attribute decision‐making problem. Here, two evaluation techniques such as technique for order of preference by similarity to ideal solution (TOPSIS) and fuzzy TOPSIS are employed to select the optimal PCM for thermal management of electronic components. The analytical hierarchy process technique is utilized to determine the weight of the attributes. The present study considers 30 PCMs and 11 attributes for the selection of best PCM. The results are compared with both the methods and it is observed that RT 44 HC is found to be optimal PCM for thermal management of electronic components. The model is validated and results are found to be in good agreement with the existing experimental results.

中文翻译：

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使用多属性决策技术选择用于电子设备热管理的相变材料

选择合适的相变材料（PCM）在潜热热管理模块的开发中起着至关重要的作用。通常，选择不合适的材料会导致产品过早失效，从而导致巨大的经济损失。大多数研究人员根据他们的经验和可用性在特定的应用程序中使用PCM。设计人员需要考虑所有可能的替代方案，并根据各种相互矛盾的标准或属性进行评估。针对特定应用的PCM最佳选择是一个多属性决策问题。在此，采用两种评估技术，例如通过与理想解决方案（TOPSIS）相似性进行优先顺序排序的技术和模糊TOPSIS，来选择用于电子部件热管理的最佳PCM。分析层次处理技术用于确定属性的权重。本研究考虑了30个PCM和11个属性以选择最佳PCM。将结果与两种方法进行了比较，并且发现RT 44 HC被发现是用于电子组件热管理的最佳PCM。对该模型进行了验证，结果与现有的实验结果非常吻合。