SnBiInZn-based high-entropy alloy (HEA) was studied as a low reflow temperature solder with melting point around 80 °C. The wetting angle is about 52° after reflow at 100 °C for 10 min. The intermetallic compound (IMC) growth kinetics was measured to be ripening-control with a low activation energy about 18.0 kJ/mol; however, the interfacial reaction rate is very slow, leading to the formation of a very thin IMC layer. The low melting point HEA solder has potential applications in advanced electronic packaging technology, especially for biomedical devices.

中文翻译：

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高熵合金，熔点极低，用于高级电子包装

SnBiInZn基高熵合金（HEA）被研究为一种低回流温度的焊料，熔点约为80°C。在100°C回流10分钟后，润湿角约为52°。经测量，金属间化合物（IMC）的生长动力学为成熟控制，活化能约为18.0 kJ / mol；然而，界面反应速率非常慢，导致形成了非常薄的IMC层。低熔点HEA焊料在先进的电子封装技术中具有潜在的应用，尤其是在生物医学设备中。