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Incorporation of a nano/micro CuO formulation into phenol formaldehyde (PF) resin: Curing kinetics, morphological analysis, and application
Journal of Wood Chemistry and Technology ( IF 2 ) Pub Date : 2019-07-11 , DOI: 10.1080/02773813.2019.1636822
Congnan Guo 1, 2, 3 , Tengfei Yi 3, 4 , Jeffrey J. Morrell 4 , Wei Gao 1, 2, 3 , Sisi Zhao 1, 2, 3 , Ke Zhan 1, 2, 3 , Long Yang 3 , Guanben Du 1, 2, 3
Affiliation  

The effects of incorporation of nano-CuO into phenol formaldehyde (PF) resin during sythesis on curing kinetics, nano-CuO structure and bond quality were investigated on orientated strand board (OSB). Apparent activation energy of the PF resins modified with CuO was decreased during the reaction indicating an acceleration of both addition and condensation reactions. X-ray diffraction data indicated that the Cu was in a bivalent state. Morphological analysis confirmed that CuO was uniformly dispersed at both nano and micro scales. Addition of nano-CuO to PF resin was associated with significantly higher internal bond strength on OSB panels. The results suggest that nano-CuO enhances the properties of conventional PF resin to imporve panel properties.

中文翻译:

将纳米/微米 CuO 配方掺入苯酚甲醛 (PF) 树脂:固化动力学、形态分析和应用

在定向刨花板 (OSB) 上研究了在合成过程中将纳米 CuO 掺入酚醛 (PF) 树脂中对固化动力学、纳米 CuO 结构和粘合质量的影响。在反应过程中,用 CuO 改性的 PF 树脂的表观活化能降低,表明加成和缩合反应加速。X-射线衍射数据表明Cu处于二价状态。形态分析证实,CuO 在纳米和微米尺度上均匀分散。在 PF 树脂中添加纳米 CuO 与 OSB 面板上显着更高的内部粘合强度有关。结果表明,纳米CuO增强了传统PF树脂的性能,从而改善了面板性能。
更新日期:2019-07-11
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