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Bending reliability of Ni–MWCNT composite solder with a differential structure
Microelectronics Reliability ( IF 1.6 ) Pub Date : 2020-10-01 , DOI: 10.1016/j.microrel.2020.113934
Choong-Jae Lee , Byeong-Uk Hwang , Kyung Deuk Min , Jae-Ha Kim , Seung-Boo Jung

Abstract A carbon nanotube (CNT) has remarkable properties, but it has disadvantages in application because of its dispersal- and bonding-related issues. Metal–CNT composite materials are necessary in solving these problems. In this study, nickel (Ni)–multi-walled CNTs (Ni–MWCNTs) are synthesized through sequential processing, functionalizing, and electroless plating processes to deposit Ni nanoparticles on MWCNTs. The synthesized Ni–MWCNTs are used to fabricate composite solders with various contents (0, 0.05, 0.1, and 0.2 wt%). The test kit used for the 3-point bending test in this study is designed with a differential package structure to evaluate the bending reliabilities of the Ni–MWCNT composite materials with various contents. The crack initiation and propagation in the microstructure evolution solder joints are also investigated. The bending reliabilities improve with the BGA structure and indicate that the highest bending cycle fails with 0.1 wt% of Ni–MWCNTs. The chemical composition and distribution of the Ni–MWCNTs in the solder joints are investigated with electron probe microanalysis.

中文翻译:

差异结构Ni-MWCNT复合焊料的弯曲可靠性

摘要 碳纳米管(CNT)具有显着的特性,但由于其分散和键合相关问题,在应用中存在缺陷。金属-碳纳米管复合材料是解决这些问题所必需的。在这项研究中,镍(Ni)-多壁碳纳米管(Ni-MWCNTs)通过顺序加工、功能化和化学镀工艺合成,以在多壁碳纳米管上沉积镍纳米颗粒。合成的 Ni-MWCNTs 用于制造不同含量(0、0.05、0.1 和 0.2 wt%)的复合焊料。本研究中用于 3 点弯曲试验的测试套件采用差分封装结构设计,以评估各种含量的 Ni-MWCNT 复合材料的弯曲可靠性。还研究了微观结构演变焊点中的裂纹萌生和扩展。BGA 结构提高了弯曲可靠性,表明使用 0.1 wt% 的 Ni-MWCNTs 时最高弯曲循环失败。用电子探针微量分析研究了焊点中 Ni-MWCNTs 的化学成分和分布。
更新日期:2020-10-01
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