A new submillimeter-thick loop heat pipe (LHP) fabricated using two copper sheets is proposed as a cooling solution for thermal management of electronics. The experimental investigation was conducted by measuring the temperature of each part of the surface of the thin LHPs for its heat input, to evaluate the heat transport characteristics of the LHPs discussed in this paper. Submillimeter LHPs with thicknesses of 0.6 and 0.4 mm were fabricated using chemical etching and diffusion bonding processes on two thin copper sheets. A design is exhibited that achieves efficient heat transfer under a variety of operating orientations with a thin LHP, by using a half-etching process on a thin copper sheet to form a grooved structure that generates capillary force. A thermal resistance of 0.09 K/W between the evaporator and the condenser is achieved at 5 W in the top heat orientation, using a nonwoven fabric consisting of copper fibers located inside the flow path of one of the copper sheets. Moreover, it is demonstrated that heat transport can be achieved up to a heat input amount of 7.5 W without orientation dependence for an ultrathin LHP of 0.4 mm thickness.

提出了一种新的亚毫米厚的回路热管（LHP），该热管使用两块铜片制成，作为电子设备热管理的冷却解决方案。通过测量薄LHP的表面各部分的热输入进行实验研究，以评估本文讨论的LHP的热传递特性。使用化学蚀刻和扩散结合工艺在两个薄铜板上制造了厚度为0.6和0.4毫米的亚毫米级LHP。展示了一种设计，该设计通过在薄铜板上使用半蚀刻工艺以形成产生毛细作用力的开槽结构，从而在薄LHP的情况下在各种操作方向上实现了有效的传热。热阻为0。蒸发器与冷凝器之间的最高热取向为5 W时，使用位于铜片之一的流道内的由铜纤维组成的无纺布，在蒸发器和冷凝器之间达到09 K / W。此外，对于0.4mm厚的超薄LHP，证明了可以达到7.5W的热输入量而无取向依赖性地进行热传递。