Abstract Turbulent heat transfer attracts continuous attention from researchers due to the high convective heat transfer performance. In the mini-channel heat sink, turbulent heat transfer enhancement measures may improve the heat transfer coefficient further and reduce the mass flow rate. However, there is lack of turbulent heat transfer enhancement researches in the mini-channel heat sink due to the difficulty caused by entrance effect. In this paper, a novel heat transfer enhancement concept of enhancing the original flow pattern was successfully applied to enhance the turbulent heat transfer in the mini-channel heat sink. The investigation was carried out in a mini-channel heat sink whose substrate size was 50mm × 50mm with Reynolds number ranging from 3600 to 6800. The original flow pattern in the conventional heat sink was revealed firstly. Subsequently, the v-ribs roughness was applied to generate multi-longitudinal swirls flow so as to enhance the original flow pattern. The numerical results indicated that the variation ranges of Nu/Nu0, f/f0, EEC, and R3 were 1.71–3.55, 2.76–7.99, 0.32–0.89, and 1.12–2.06, respectively, in the mini-channel. Besides, the maximum average heat flux of the substrate could achieve 5.79 W/mm2 within a temperature difference of 60 K. In addition, this paper also investigated the thermal resistance and irreversibility in the mini-channel heat sink. This work may promote the development of heat transfer enhancement.

中文翻译：

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通过使用 V 形肋增强原始流动模式来增强微通道中的湍流传热

摘要 湍流传热由于具有较高的对流换热性能而受到研究人员的持续关注。在微通道散热器中，湍流传热增强措施可以进一步提高传热系数并降低质量流量。然而，由于入口效应造成的困难，在微通道散热器中缺乏湍流传热增强研究。在本文中，一种新的增强原始流动模式的传热增强概念成功应用于增强微通道散热器中的湍流传热。研究在基板尺寸为 50mm × 50mm、雷诺数范围为 3600 至 6800 的微型通道散热器中进行。首先揭示了传统散热器中的原始流动模式。随后，应用 V 形肋粗糙度以产生多纵向涡流，以增强原始流动模式。数值结果表明，微通道中 Nu/Nu0、f/f0、EEC 和 R3 的变化范围分别为 1.71-3.55、2.76-7.99、0.32-0.89 和 1.12-2.06。此外，基板的最大平均热通量可以在 60 K 的温差内达到 5.79 W/mm2。此外，本文还研究了微通道散热器的热阻和不可逆性。这项工作可能会促进传热强化的发展。在迷你通道中分别为 99、0.32-0.89 和 1.12-2.06。此外，基板的最大平均热通量可以在 60 K 的温差内达到 5.79 W/mm2。此外，本文还研究了微通道散热器的热阻和不可逆性。这项工作可能会促进传热强化的发展。在迷你通道中分别为 99、0.32-0.89 和 1.12-2.06。此外，基板的最大平均热通量可以在 60 K 的温差内达到 5.79 W/mm2。此外，本文还研究了微通道散热器的热阻和不可逆性。这项工作可能会促进传热强化的发展。