Herein, the effect of sputtering rate on the fraction of special grain boundaries in 5xxx series Al–Mg alloys is explored. Samples are synthesized via interrupted direct current (DC) magnetron sputtering with varying deposition rates, and the grain size and grain boundary character are evaluated with electron backscatter diffraction (EBSD). The highest sputtering rate (7 nm s⁻¹) leads to an increase in the total number of special grain boundaries, ≈1.5× greater than that of the lower rates. Increased thermal energy and enhanced stress relaxation during film growth promote the formation of Σ3 and Σ7 boundaries.

中文翻译：

---

晶界工程铝镁合金的表征

在此，探讨了溅射速率对5xxx系列Al-Mg合金中特殊晶界分数的影响。通过不连续的直流（DC）磁控溅射以不同的沉积速率合成样品，并通过电子背散射衍射（EBSD）评估晶粒尺寸和晶界特征。最高溅射速率（7 nm s ^-1）导致特殊晶界总数的增加，比较低速率的晶界总数增加≈1.5倍。膜生长过程中增加的热能和增强的应力松弛会促进Σ3和Σ7边界的形成。