Abstract The aim of this paper is to study the algebraic aspects of the gluing procedure in the category of differential spaces. In particular, the Sikorski differential spaces are studied. The algebraic techniques are mainly based on the spectral approach. This paper is a continuation of some previous researches in differential spaces techniques.

中文翻译：

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微分空间粘合的一些代数方面

摘要 本文的目的是研究微分空间范畴中胶合程序的代数方面。特别地，研究了 Sikorski 微分空间。代数技术主要基于谱方法。本文是对微分空间技术的一些先前研究的延续。