Abstract The use of an intervening adhesion layer is essential in reliable fabrication of noble metallic nanostructures for optical and electronic devices. However, many emerging applications such as plasmonics and transfer printing raise the demand of metallic structures without adhesion layers, either to mitigate the plasmon damping or to facilitate the transfer processes. In this work, we systematically investigate the fabrication reliability of adhesion-free lithographic gold nanostructures on Si wafers and gold-coated substrates using a wet lift-off process. According to a large amount of statistical results, we comprehensively evaluate the patterning behavior of metallic nanostructures without adhesion promotion. Analytical modelling and control experiments are carried out to characterize the mechanics of their failure behaviors as a function of morphology and surface property. Our work provides useful information to the nanofabrication community to obtain adhesion-free gold nanostructures for plasmonic and transfer printing applications.

中文翻译：

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使用湿剥离法制备金纳米结构而无需促进粘附

摘要 中间粘合层的使用对于可靠制造用于光学和电子设备的贵金属纳米结构至关重要。然而，许多新兴应用，如等离子体和转移印刷，增加了对没有粘附层的金属结构的需求，以减轻等离子体阻尼或促进转移过程。在这项工作中，我们系统地研究了使用湿剥离工艺在硅晶片和镀金基板上无粘附光刻金纳米结构的制造可靠性。根据大量的统计结果，我们综合评估了没有粘附促进的金属纳米结构的图案化行为。进行分析建模和控制实验以将其失效行为的力学表征为形态和表面特性的函数。我们的工作为纳米制造社区提供了有用的信息，以获得用于等离子体和转移印刷应用的无粘附金纳米结构。