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Microstructural and Micromechanical Characteristics of Tin-Based Solders Under Self-Propagating Exothermic Reaction Heating
Journal of Electronic Materials ( IF 2.1 ) Pub Date : 2020-08-13 , DOI: 10.1007/s11664-020-08363-9
Zheng Zhou , Anna Zhang , Xu Guan , Hui Liu , Changqing Liu , Fengshun Wu

In this study, a rapid solder melting process has been examined through a self-propagating exothermic reaction using Al/Ni nanofoil as a localized heat source. Four kinds of tin-based solder preforms were partly melted under this process, and the thicknesses of the fusion zone in solder preforms around the Al/Ni nanofoil were experimentally analyzed. The microstructure and morphology of the fusion zone in different kinds of solder preforms were studied by metallographic analysis. In Sn42Bi58 solder, the mean grain size of Bi-rich phases in the fusion zone was finer than the original structure, and decreased from ~ 2.7 μm to ~ 0.8 μm away from the Al/Ni nanofoil. Similar trends of mean size of grains in the fusion zone were also found in the Sn, Sn-3 wt.%Ag-0.5 wt.%Cu(SAC), and SnPb solder preforms. The widths of the fusion zone in the Sn, SAC, SnPb, and SnBi solder preforms were 150 μm, 173 μm, 188 μm, and 233 μm, respectively. In addition, the nano-hardness and distribution in the fusion zones were evaluated. The results show that the value of nanohardness increased along with the decrease of distance from Al/Ni nanofoil. The average hardness and the lower and upper bounds of Sn, SnPb, SAC, and SnBi solder in the fusion zone are 0.260 (−0.045, +0.039) GPa, 0.246 (−0.059, +0.114) GPa, 0.260 (−0.014, +0.070) GPa, and 0.404 (−0.072, +0.134) GPa, respectively. The statistical significance of solder hardness is related to its alloy component, element content, and microstructure.



中文翻译:

自蔓延放热反应加热条件下锡基焊料的显微组织和微机械特性

在这项研究中,已经通过使用Al / Ni纳米箔作为局部热源的自蔓延放热反应研究了快速焊料熔化过程。在此过程中,四种类型的锡基焊料预成型件被部分熔化,并通过实验分析了围绕Al / Ni纳米箔的焊料预成型件中熔合区的厚度。通过金相分析研究了不同类型的焊料预成型件中熔合区的组织和形态。在Sn的4258焊料,在熔融部的富Bi相的平均晶粒尺寸是比原来的结构更细,并且从〜2.7降低 μ m至0.8〜  μ距离Al / Ni纳米箔m。在Sn,Sn-3 wt。%Ag-0.5 wt。%Cu(SAC)和SnPb焊料预成型件中,也发现了熔合区晶粒平均尺寸的相似趋势。包含于上述Sn,SAC,锡铅,和锡铋焊料预型件的熔融部的宽度分别为150  μ米,173  μ米,188  μ m和233  μ米,分别。另外,评估了熔合区的纳米硬度和分布。结果表明,随着距Al / Ni纳米箔距离的减小,纳米硬度值增加。Sn,SnPb,SAC和SnBi焊料在熔化区的平均硬度和上下限分别为0.260(-0.045,+0.039)GPa,0.246(-0.059,+0.114)GPa,0.260(-0.014,+ 0.070)GPa和0.404(-0.072,+0.134)GPa。焊料硬度的统计意义与其合金成分,元素含量和微观结构有关。

更新日期:2020-09-01
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