This Letter presents a novel RF ground lead structure for surface-mount-type optical modules that enables RF crosstalk reduction and bandwidth enhancements. Conventional RF lead-pins of a surface-mount-type optical module have a bent shape that affects on RF ground stability and RF crosstalk between channels. The authors introduced an enhanced ground lead with an optimised shape for RF ground scheme enhancement. They prepared two types of high-bandwidth coherent driver modulator packages for demonstrating RF performance difference, one with the conventional bent ground lead and the other with the optimum-shaped ground lead. The measured results of the package with the enhanced ground lead successfully exhibited adjacent far-end crosstalk reduction of about 5 dB at 50 GHz, and the crosstalk of −30 dB or less up to 58 GHz was confirmed. Moreover, they obtained the improvement in the insertion loss of 1 dB at 54 GHz and the 3-dB electrical bandwidth enhancement of 2 GHz. These RF performances are sufficient for a high-bandwidth coherent driver modulator package that allows 96-GBd class operations.

中文翻译：

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通过引入增强型接地引线结构减少相干驱动器调制器封装的 RF 输入通道之间的串扰

本文介绍了一种用于表面安装型光学模块的新型 RF 接地引线结构，可减少 RF 串扰并增强带宽。表面贴装型光学模块的传统 RF 引脚具有弯曲形状，会影响 RF 接地稳定性和通道之间的 RF 串扰。作者介绍了一种具有优化形状的增强型接地引线，用于增强射频接地方案。他们准备了两种类型的高带宽相干驱动器调制器封装来展示 RF 性能差异，一种带有传统的弯曲接地引线，另一种带有最佳形状的接地引线。具有增强型接地引线的封装的测量结果成功地展示了在 50 GHz 下约 5 dB 的相邻远端串扰降低，并且在高达 58 GHz 时证实了 -30 dB 或更低的串扰。而且，他们在 54 GHz 下获得了 1 dB 插入损耗的改进和 2 GHz 下 3 dB 电带宽的增强。这些 RF 性能足以满足允许 96-GBd 级操作的高带宽相干驱动器调制器封装。