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Simulation research of high-efficiency unidirectional vertical coupling grating couplers for optical through-silicon vias in 3D optoelectronic integrated circuits
Optics Communications ( IF 2.4 ) Pub Date : 2021-01-01 , DOI: 10.1016/j.optcom.2020.126408
Junqin Zhang , Ci Zhang , Guoxian Liang , Yintang Yang

Abstract A unidirectional vertical coupling structure is designed based on optical through-silicon vias (TSVs) and gratings to couple and steer the optical interconnects in 3D optoelectronic integrated circuits. The optical TSVs provide high-speed vertical optical data transmission over short distances. The grating coupler structure achieves efficient coupling between an optical TSV and a planar Si waveguide. Through the action of a mirror that covered the end of the optical TSV cladding and a distributed Bragg reflector(DBR) positioned on the far side away from the waveguide, coupling efficiency of 80% at 1550 nm is obtained in simulations. Our proposed vertical coupling structure represents a high-efficiency solution for 3D optical interconnects and can play an important role in 3D optoelectronic integrated circuits.

中文翻译:

3D光电集成电路中硅通孔高效单向垂直耦合光栅耦合器仿真研究

摘要 基于光学硅通孔 (TSV) 和光栅设计了一种单向垂直耦合结构,用于耦合和引导 3D 光电集成电路中的光学互连。光学 TSV 提供短距离的高速垂直光学数据传输。光栅耦合器结构实现了光学 TSV 和平面硅波导之间的有效耦合。通过覆盖光学 TSV 包层末端的反射镜和位于远离波导的远侧的分布式布拉格反射器 (DBR) 的作用,仿真中在 1550 nm 处获得了 80% 的耦合效率。我们提出的垂直耦合结构代表了 3D 光互连的高效解决方案,可以在 3D 光电集成电路中发挥重要作用。
更新日期:2021-01-01
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