The deposition behavior of copper particles during the aerosol deposition (AD) process was predicted according to the particle velocity via a numerical model. Plastic deformation of Cu particles was predicted by a cumulative effect among the injected carrier gas consumption, particle velocity, internal energy, compressive strain, and heat-induced thermal softening of the particle. Besides, there is possibility on oxidation of copper, which is influence on increase of electrical resistivity, caused by the induced heat. To compare the simulation results and understand the actual deposition behavior of Cu particles, Cu films were fabricated through AD using subdivided gas consumptions. The microstructure was confirmed by both the plastic strain through the Williamson–Hall plot and the strain results by the simulation. From the simulation and X-ray analysis, the characteristic of induced heat was analyzed to demonstrate the influence on oxidation, and to obtain suitable AD condition...

中文翻译：

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粉末喷涂铜粒子在室温下的变形机理

根据颗粒速度，通过数值模型预测了气溶胶沉积（AD）过程中铜颗粒的沉积行为。通过注入的载气消耗量，颗粒速度，内部能量，压缩应变和颗粒的热诱导热软化之间的累积效应，可预测Cu颗粒的塑性变形。此外，铜的氧化有可能被感应的热量影响到电阻率的增加。为了比较模拟结果并了解Cu颗粒的实际沉积行为，使用细分的气体消耗量通过AD制造了Cu膜。通过Williamson-Hall曲线的塑性应变和通过模拟得出的应变结果，证实了微观结构。