Abstract Time–temperature superposition is a well-established principle used in the constitutive description of viscoelastic polymers. To expand the description to moisture-induced plasticization effects, two epoxide-based molding compounds used in microelectronics packaging were characterized by dynamic mechanical analysis under varying temperature and moisture controlled environments in their glassy regime. Conditions of up to 85 °C and 85% relative humidity, relevant for industry-defined reliability standards, were applied. By relating the transient ambient conditions to the actual moisture concentration of the samples, temperature-, and moisture concentration-dependent relaxation functions were obtained. By applying a time–temperature–moisture concentration superposition, it is shown, that the materials' behavior can be described assuming a linear dependence of the relative free volume on both temperature and concentration. The two parameters can be super-positioned in the description of the shift of the relaxation time constant spectrum with negligible cross-correlation for the conditions of industrial interest.

中文翻译：

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描述用于微电子封装的环氧化物模塑料的弛豫行为的时间-温度-水分浓度叠加原理

摘要 时间-温度叠加是用于粘弹性聚合物本构描述的公认原理。为了将描述扩展到湿气诱导的塑化效应，微电子封装中使用的两种环氧化物基模塑料在其玻璃态的不同温度和湿度控制环境下通过动态力学分析进行了表征。应用了与行业定义的可靠性标准相关的高达 85 °C 和 85% 相对湿度的条件。通过将瞬态环境条件与样品的实际水分浓度相关联，获得了与温度和水分浓度相关的松弛函数。通过应用时间-温度-水分浓度叠加，表明材料的 可以假设相对自由体积与温度和浓度呈线性相关来描述行为。这两个参数可以叠加在弛豫时间常数谱的位移的描述中，对于工业利益条件的互相关可以忽略不计。