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High resolution digital image correlation mapping of strain localization upon room and high temperature, high cycle fatigue of a TiAl intermetallic alloy
International Journal of Fatigue ( IF 6 ) Pub Date : 2021-01-01 , DOI: 10.1016/j.ijfatigue.2020.105905
Thomas Edward James Edwards , Fabio Di Gioacchino , William John Clegg

Abstract Microplasticity in a lamellar TiAl alloy upon high cycle tensile fatigue was measured by high resolution digital image correlation strain mapping at several stress and cycle increments, at 25 °C and 670 °C, for two lamellar thicknesses. Plastic deformation occurred primarily in soft-mode colonies at both temperatures, operating by slip parallel to the lamellae, and near lamellar interfaces. Plastic strains generally decreased to zero by the colony boundary; strain transfer across such boundaries was rare at both temperatures. At 25 °C, the maximum applied stress influenced the number of slip bands more so than did the number of loading cycles.

中文翻译:

TiAl金属间合金室温和高温高周疲劳应变局部的高分辨率数字图像相关映射

摘要 通过高分辨率数字图像相关应变映射在 25 °C 和 670 °C 下,在 25 °C 和 670 °C 下,对于两种层状厚度,测量了层状 TiAl 合金在高周拉伸疲劳下的微塑性。塑性变形主要发生在两种温度下的软模式菌落中,通过平行于薄片和接近薄片界面的滑动操作。塑性应变通常在菌落边界处降至零;在这两种温度下,跨这种边界的应变转移很少见。在 25 °C 时,最大外加应力对滑移带数量的影响大于加载循环次数。
更新日期:2021-01-01
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