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Photocatalytic Surface Modification of PI Film for Electroless Copper Plating
Advances in Condensed Matter Physics ( IF 1.5 ) Pub Date : 2018-01-01 , DOI: 10.1155/2018/1619581
Wenxia Zhao 1 , Zenglin Wang 2 , Liang Qiao 3 , Shiwei Liu 1 , Hongjian Zhao 1 , Yani Yan 1
Affiliation  

This study investigated the surface modification of polyimide (PI) film through TiO2 photocatalytic treatment. The effects of TiO2 content, treatment duration, and UV power on the surface topography, surface contact angle, and adhesion strength of the surface-modified PI films were investigated. The results indicated that, after surface modification under the optimal photocatalytic conditions, the surface contact angle of the PI film decreased from 84.4° to 38.8°, and the adhesion strength between the PI film and the electroless copper film reached 0.78 kN/m. X-ray photoelectron spectroscopy analysis further demonstrated that carboxyl groups formed on the surface of the PI film after photocatalytic treatment. The surface hydrophilicity and adhesion strength of the surface-modified PI film were enhanced due to the numerous carboxyl groups formed on its surface. Therefore, the photocatalytic treatment is an environmentally friendly and effective method for the surface modification of PI films.

中文翻译:

化学镀铜用PI薄膜的光催化表面改性

本研究调查了通过 TiO2 光催化处理对聚酰亚胺 (PI) 薄膜的表面改性。研究了 TiO2 含量、处理时间和紫外线功率对表面改性 PI 薄膜的表面形貌、表面接触角和粘附强度的影响。结果表明,在最佳光催化条件下进行表面改性后,PI薄膜的表面接触角从84.4°降低到38.8°,PI薄膜与化学镀铜薄膜的附着强度达到0.78 kN/m。X射线光电子能谱分析进一步表明,经过光催化处理后,PI薄膜表面形成了羧基。表面改性的 PI 膜由于其表面形成了大量的羧基,其表面亲水性和粘附强度得到增强。因此,光催化处理是一种环保且有效的PI薄膜表面改性方法。
更新日期:2018-01-01
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