Abstract This paper studies the problem of allocating semiconductor wafers to customer orders with the objective of minimizing the overallocation prior to assembly. It is an important problem for back-end semiconductor manufacturing as overallocation may have severe impact on operational performance due to excess inventory and unnecessarily occupied manufacturing equipment. In practice, a wafer can contain dies from several different die classes, making the wafer-allocation problem more challenging. As a novel contribution of this work, we explicitly consider the existence of multiple die classes on a wafer in the wafer-allocation problem. An integer linear programming formulation of the class-constrained wafer allocation problem is provided. The formulation is further extended to be more flexible by allowing the dies from different classes on the same wafer to be allocated to distinct customer orders. A real-world case study from the back-end assembly and test facility of a semiconductor manufacturer is presented. Experiments with real-world data show that the proposed method significantly reduces the overallocation performance in current practice and allows planners to quantify the value of flexibility in wafer allocation.

中文翻译：

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优化半导体后端生产中受类限制的晶圆到订单分配

摘要 本文研究了将半导体晶圆分配给客户订单的问题，以尽量减少组装前的过度分配。这是后端半导体制造的一个重要问题，因为过度分配可能会由于库存过多和不必要地占用制造设备而对运营绩效产生严重影响。实际上，一个晶圆可以包含来自多个不同芯片类别的芯片，这使得晶圆分配问题更具挑战性。作为这项工作的一项新贡献，我们在晶圆分配问题中明确考虑了晶圆上多个芯片类别的存在。提供了类约束晶圆分配问题的整数线性规划公式。通过允许将同一晶片上不同类别的芯片分配给不同的客户订单，该公式进一步扩展为更加灵活。介绍了来自半导体制造商后端组装和测试设施的真实案例研究。真实世界数据的实验表明，所提出的方法显着降低了当前实践中的过度分配性能，并允许规划人员量化晶圆分配灵活性的价值。