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Preparation of Chloride Salt of Octa (Aminopropylsilsesquioxane) Filled Low-κ Epoxy Composites with Improved Thermal Stability and Low Water Absorption
Polymer-Plastics Technology and Materials ( IF 2.7 ) Pub Date : 2020-08-20 , DOI: 10.1080/25740881.2020.1784224
Yongke Zhao 1, 2 , Guomin Song 1, 2 , Guangxin Chen 2, 3 , Zheng Zhou 1, 2 , Qifang Li 1, 2
Affiliation  

Herein, a kind of low-κ epoxy composites with excellent comprehensive properties were prepared by introducing chloride salt of octa (aminopropylsilsesquioxane). The dielectric constant (106 Hz) of the composite was decreased by 0.94 when the fillers loading was only 3 wt%. The thermal stability and shore hardness were both improved, and the water adsorption was reduced. The improved properties of the composites were mainly attributed to the intrinsic cage-like structure of the filler and its good dispersion in the matrix. Moreover, the strong interface interaction between the filler and matrix also played an important role.



中文翻译:

改进的热稳定性和低吸水率的八聚(氨基丙基倍半硅氧烷)填充的低κ环氧复合材料氯化物盐的制备

在此,通过引入八氯化物的氯盐(氨基丙基倍半硅氧烷),制备了一种综合性能优异的低κ环氧复合材料。 当填料的负载量仅为3wt%时,复合材料的介电常数(10 6 Hz)降低了0.94。热稳定性和肖氏硬度均得到改善,并且吸水率降低。复合材料性能的改善主要归因于填料固有的笼状结构及其在基体中的良好分散性。此外,填料与基质之间的强界面相互作用也起着重要作用。

更新日期:2020-08-20
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