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tert-Butylamine borane as a reductant in electroless nickel plating for improved etch resistance in the electrolyte
Bulletin of Materials Science ( IF 1.8 ) Pub Date : 2020-08-20 , DOI: 10.1007/s12034-020-02186-4
Sollee Kim , Sukeun Yoon

An Ni–B coating was developed on a copper substrate by the direct electroless technique and from a plating bath containing tert-butylamine borane (TBAB). The influence of the electroless plating conditions, using TBAB as a reducing agent on the composition, surface morphology, high-temperature stability and etch resistance in the electrolyte of the coatings, was investigated. The resulting electroless Ni–B plating surfaces were examined and characterized by scanning electron microscopy and X-ray fluorescence spectroscopy for morphology and chemical composition, respectively. Electrochemical characterization by potentiodynamic polarization confirmed that a 0.1 M nickel concentration bath for the Ni–B plating was optimized by a TBAB concentration of 0.03 M, temperature of 60°C and pH of 8. Under the optimal bath conditions, the Ni–B electroless plating layer exhibited superior etch resistance in the electrolyte as well as improved stability at high temperature than the Ni–B electroless plating layer prepared using dimethylamine borane. Hence, owing to the remarkable properties of the Ni–B electroless plating layer, this fabrication technique that employs TBAB can be extended to fabricate other Ni–B electroless plating layers.

中文翻译:

叔丁胺硼烷作为化学镀镍中的还原剂,以提高电解液的耐蚀刻性

Ni-B 涂层是通过直接化学镀技术和含有叔丁胺硼烷 (TBAB) 的电镀液在铜基材上开发的。研究了化学镀条件对镀层的组成、表面形貌、高温稳定性和耐蚀性的影响,使用 TBAB 作为还原剂。通过扫描电子显微镜和 X 射线荧光光谱分别检查和表征所得化学镀 Ni-B 表面的形态和化学成分。通过动电位极化的电化学表征证实,通过 0.03 M 的 TBAB 浓度、60°C 的温度和 8 的 pH 值优化了用于 Ni-B 电镀的 0.1 M 镍浓度镀液。在最佳镀液条件下,与使用二甲胺硼烷制备的 Ni-B 化学镀层相比,Ni-B 化学镀层在电解液中表现出优异的耐蚀刻性以及更高的高温稳定性。因此,由于 Ni-B 化学镀层的显着特性,这种使用 TBAB 的制造技术可以扩展到制造其他 Ni-B 化学镀层。
更新日期:2020-08-20
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