Back grinding of wafer with outer rim (BGWOR) is a new method for carrier-less thinning of silicon wafers. At present, the effects of process parameters on the grinding force remain debatable. Therefore, a BGWOR normal grinding force model based on grain depth-of-cut was established, and the relationship between grinding parameters (wheel infeed rate, wheel rotational speed, and chuck rotational speed) and normal grinding force was discussed. Further, a series of experiments were performed to verify the BGWOR normal grinding force model. This study proves that the BGWOR normal grinding force is related to the rotational direction of the wheel and chuck, and the effect of grinding mark density on the BGWOR normal grinding force cannot be ignored. Moreover, this study provides methods for reducing the grinding force and optimizing the back thinning process of the silicon wafer.

中文翻译：

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外缘晶片反磨中的磨削力研究

带有外缘的晶圆背面研磨（BGWOR）是一种无载体减薄硅晶圆的新方法。目前，工艺参数对磨削力的影响尚有争议。因此，建立了基于切削深度的BGWOR法向磨削力模型，并讨论了磨削参数（砂轮进给速度，砂轮转速和卡盘转速）与法向磨削力之间的关系。此外，进行了一系列实验以验证BGWOR法向磨削力模型。这项研究证明了BGWOR法向磨削力与砂轮和卡盘的旋转方向有关，并且磨削痕迹密度对BGWOR法向磨削力的影响不容忽视。此外，