With the development of science and technology, microelectronic components have evolved to become increasingly integrated and miniaturized. As a result, thermal management, which can seriously impact the function, reliability, and lifetime of such components, has become a critical issue. Recently, the use of polymer-based thermal interface materials (TIMs) in thermal management systems has attracted considerable attention in view of the superior comprehensive properties of the former. Compared with designing and fabricating a polymer with an intrinsically high thermal conductivity, a more effective and widely used strategy for improving the heat conductivity is to fill a polymer matrix with a thermally conductive filler. Specifically, three-dimensional (3D) interconnected heat-conductive networks can increase the thermal conductivity (k) of polymers more effectively than dispersed fillers can, owing to their intrinsic continuous structures. In this review, we first introduce the heat conduction mechanisms and the problems associated with polymer-based TIMs fabricated using engineering polymer chains and traditional filling methods. Next, we discuss the advantages and mechanisms of 3D interconnected heat-conductive networks for preparing thermally conductive polymer-based composites. In addition, we highlight new advancements in the design and fabrication of 3D thermally conductive networks as well as their application in improving the k of polymers. Our exhaustive review of 3D interconnected networks includes graphene, carbon nanotubes, boron nitride, metal and other 3D hybrid architectures. The key structural parameters and control methods for improving the thermal properties of polymer composites are outlined. Finally, we summarize some effective strategies and possible challenges for the development of polymer-based thermally conductive composites via integration with 3D interconnected networks.

随着科学技术的发展，微电子元件已经发展为越来越集成和小型化。结果，严重影响此类组件的功能，可靠性和寿命的热管理已成为一个关键问题。最近，鉴于前者的优越综合性能，在热管理系统中使用基于聚合物的热界面材料（TIMs）引起了相当大的关注。与设计和制造具有本质上高导热率的聚合物相比，一种更有效和广泛使用的提高导热率的策略是用导热填料填充聚合物基体。具体来说，三维（3D）互连的导热网络可以提高导热系数（k）聚合物由于其固有的连续结构而比分散的填料更有效。在这篇综述中，我们首先介绍了导热机理以及与使用工程聚合物链和传统填充方法制造的聚合物基TIM相关的问题。接下来，我们讨论用于制备导热聚合物基复合材料的3D互连导热网络的优点和机理。另外，我们强调在三维导热网络的设计和制造新的进步，以及他们在提高应用ķ聚合物。我们对3D互连网络的详尽介绍包括石墨烯，碳纳米管，氮化硼，金属和其他3D混合体系结构。概述了改善聚合物复合材料热性能的关键结构参数和控制方法。最后，我们总结了通过与3D互连网络集成来开发基于聚合物的导热复合材料的一些有效策略和可能面临的挑战。