Abstract Star-shaped arylacetylene resins, tris(3-ethynyl-phenylethynyl)methylsilane, tris(3-ethynyl-phenylethynyl) phenylsilane, and tris (3-ethynyl-phenylethynyl) silane (TEPHS), were synthesized through Grignard reaction between 1,3-diethynylbenzene and three types of trichlorinated silanes. The chemical structures and properties of the resins were characterized by means of nuclear magnetic resonance, fourier-transform infrared spectroscopy, Haake torque rheomoter, differential scanning calorimetry, dynamic mechanical analysis, mechanical test, and thermogravimetric analysis. The results show that the melt viscosity at 120 °C is lower than 150 mPa⋅s, and the processing windows are as wide as 60 °C for the resins. The resins cure at the temperature as low as 150 °C. The good processabilities make the resins to be suitable for resin transfer molding. The cured resins exhibit high flexural modulus and excellent heat-resistance. The flexural modulus of the cured TEPHS at room temperature arrives at as high as 10.9 GPa. Its temperature of 5% weight loss (T d5) is up to 697 °C in nitrogen. The resins show the potential for application in fiber-reinforced composites as high-performance resin in the field of aviation and aerospace.

中文翻译：

---

衍生自硅的星形芳基乙炔树脂

摘要 星形芳乙炔树脂、三(3-乙炔基-苯基乙炔基)甲基硅烷、三(3-乙炔基-苯基乙炔基)苯基硅烷和三(3-乙炔基-苯基乙炔基)硅烷(TEPHS)，通过1,3 -二乙炔苯和三种三氯化硅烷。通过核磁共振、傅里叶变换红外光谱、哈克转矩流变仪、差示扫描量热法、动态力学分析、力学测试和热重分析等手段对树脂的化学结构和性能进行了表征。结果表明，120 °C 时的熔体粘度低于 150 mPa·s，树脂的加工窗口宽达 60 °C。树脂可在低至 150 °C 的温度下固化。良好的加工性能使该树脂适用于树脂传递模塑。固化后的树脂表现出高弯曲模量和优异的耐热性。室温下固化 TEPHS 的弯曲模量高达 10.9 GPa。其重量损失 5% (T d5) 的温度在氮气中高达 697 °C。该树脂显示出在纤维增强复合材料中作为航空航天领域高性能树脂的应用潜力。