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Silicon pixel sensor R&D for the CLIC tracking detector
Journal of Instrumentation ( IF 1.3 ) Pub Date : 2020-08-05 , DOI: 10.1088/1748-0221/15/08/c08005
J. Kröger 1, 2
Affiliation  

The physics aims at the proposed high-energy $e^+e^-$ collider CLIC pose challenging demands on the performance of the detector system. Precise hit-time tagging, an excellent spatial resolutions, and a low mass are required for the vertex and tracking detectors. To meet these requirements, an all-silicon vertex and tracking detector system is foreseen, for which a broad R&D programme on a variety of novel silicon detector technologies is being pursued. For the ultra-low mass vertex detector, different hybrid technologies with innovative sensor concepts and interconnection techniques are explored. For the large-scale tracking detector, the focus of the R&D lies on monolithic HV-MAPS and HR-CMOS technologies. This contribution gives an overview of the ongoing activities with a focus on monolithic technologies for the CLIC tracking detector. Recent results from laboratory and test-beam measurement campaigns of the ATLASpix_Simple and the CLICTD sensor prototypes are presented.

中文翻译:

CLIC追踪检测器硅像素传感器研发

物理学旨在提出的高能 $e^+e^-$ 对撞机 CLIC 对探测器系统的性能提出了具有挑战性的要求。顶点和跟踪检测器需要精确的命中时间标记、出色的空间分辨率和低质量。为了满足这些要求,可以预见到全硅顶点和跟踪探测器系统,为此正在对各种新型硅探测器技术进行广泛的研发计划。对于超低质量顶点探测器,探索了具有创新传感器概念和互连技术的不同混合技术。对于大规模跟踪探测器,研发的重点在于单片HV-MAPS和HR-CMOS技术。此贡献概述了正在进行的活动,重点是 CLIC 跟踪检测器的单片技术。
更新日期:2020-08-05
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