W-Cu functionally graded composites (FGCs) up to six layers have been developed using high energy ball milling and spark plasma sintering (SPS) at a lower temperature of 900 °C. The relative density of W-Cu composites increased from 85.4% (W₈₀Cu₂₀ layer) to 95.7% (W₂₀Cu₈₀ layer) with increasing Cu content. All the W-Cu FGCs exhibited a graded structure even after SPS and showed a gradual change in hardness, Young’s modulus, and coefficient of thermal expansion (CTE). Furthermore, W-Cu composites showed a CTE and modulus between those of W and Cu and could be used as an intermediate layer between W and Cu in plasma facing components. The thermal cycle testing at 800 °C has confirmed that the W-Cu FGCs developed in this study can withstand thermal shock and showed a superior performance over directly bonded W-Cu sample. The W-Cu FGCs developed in the present study are not only suitable for plasma facing components but can also be used where the thermal stresses are introduced due to the large mismatch in CTE or elastic modulus.

使用高能球磨和火花等离子体烧结（SPS）在900°C的较低温度下开发了多达六层的W-Cu功能梯度复合材料（FGC）。W-Cu复合材料的相对密度从85.4％（W ₈₀ Cu ₂₀层）增加到95.7％（W ₂₀ Cu ₈₀层）随着铜含量的增加而增加。所有W-Cu FGC甚至在SPS后仍显示出梯度结构，并且在硬度，杨氏模量和热膨胀系数（CTE）上显示出逐渐变化。此外，W-Cu复合材料的CTE和模量介于W和Cu之间，可以用作面向等离子体的组件中W和Cu之间的中间层。在800°C下进行的热循环测试已证实，本研究开发的W-Cu FGC可以承受热冲击，并表现出优于直接键合W-Cu样品的性能。在本研究中开发的W-Cu FGC不仅适用于面向等离子体的组件，而且还可以用于由于CTE或弹性模量存在较大失配而引入热应力的地方。