Transient liquid phase (TLP) bonding as an effective and precise bonding process attracted enormous attentions. However, there are several parameters affecting the mechanical properties of the joint zone which are crucial to be studied. In this work, two pieces of Inconel 625 alloy was bonded via TLP process using a BNi-2 interlayer. TLP process was done in different bonding temperatures (e.g., 1025 °C, 1100 °C, and 1175 °C) in a vacuum furnace in 10⁻⁵ bar pressure for 65 min. It is found that there is a meaningful relationship between process temperature and width of the eutectic phase zone. Results suggested that the rate of diffusion of melting point depressant atoms was increased by increasing the process temperature, leading to increasing the width of isothermal solidification zone (ISZ). It is found that the silicon and boron-rich eutectic compounds are responsible for large hardness value and weak the shear strength. To inhibit the formation of these hard and brittle phases, and to complete the ISZ region, the samples were bonded at 1175 °C and as a result, the ISZ region could be completed and mechanical properties were improved (e.g., the maximum shear strength at 1175 °C was measured to be 55.43% and 138.39% higher than 1100 °C and 1025 °C respectively). In addition to it, fracture cross-section was containing semi-cleavage and dimple shaped features which verified the completion of ISZ.

瞬态液相（TLP）键合作为一种有效而精确的键合工艺引起了极大的关注。但是，有几个影响关节区域机械性能的参数对于研究至关重要。在这项工作中，使用BNi-2夹层通过TLP工艺将两块Inconel 625合金粘合在一起。在10 ^-5的真空炉中，在不同的键合温度（例如1025°C，1100°C和1175°C）下完成TLP工艺巴压力65分钟。发现在工艺温度和共晶相区的宽度之间存在有意义的关系。结果表明，熔点降低原子的扩散速率通过提高工艺温度而增加，从而导致等温凝固区（ISZ）的宽度增加。已发现，富含硅和硼的共晶化合物可导致较大的硬度值，而削弱剪切强度。为了抑制这些硬质和脆性相的形成并完成ISZ区域，在1175°C下将样品粘合，结果可以完成ISZ区域并改善机械性能（例如，最大抗剪强度为测得1175°C分别比1100°C和1025°C高55.43％和138.39％。除此之外