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Syntactic Foams for Filling Sealing Compositions Based on Epoxy Resin and Hollow Phenol-Formaldehyde Microspheres
Polymer Science, Series D Pub Date : 2020-07-01 , DOI: 10.1134/s1995421220030053
V. Yu. Chukhlanov , O. G. Selivanov , N. V. Chukhlanova , E. E. Mastalygina

Physicomechanical, thermophysical, and electrical properties of syntactic foams based on ED-20 epoxy diane resin and hollow phenol-formaldehyde microspheres have been considered. The optimal amount of microspheres in the composition has been determined. It has been shown that hollow microspheres affect the adhesion and strength characteristics of the sealant and reduce the dielectric loss tangent in the centimeter UHF range, which allows one to recommend such syntactic foams as sealing compositions in radioelectronic equipment and antenna-feeder devices operating in the ultra-high-frequency radio range.

中文翻译:

用于填充基于环氧树脂和中空酚醛微球的密封组合物的复合泡沫

已经考虑了基于 ED-20 环氧二烷树脂和中空酚醛微球的复合泡沫的物理机械、热物理和电性能。已确定组合物中微球的最佳量。已经表明,中空微球会影响密封剂的粘附和强度特性,并降低厘米 UHF 范围内的介电损耗角正切,这使得人们可以推荐使用复合泡沫作为无线电电子设备和天线馈线设备中的密封组合物。超高频无线电范围。
更新日期:2020-07-01
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