The physics goals at the proposed future Compact Linear Collider (CLIC) pose challenging demands on the performance of the detector system. Precise hit-time tagging with a few nanoseconds resolution is required for the vertex and tracking detectors, as well as a very low mass per layer combined with a single-plane spatial resolution of a few micrometres. To address these requirements, an all silicon vertex and tracking system is foreseen at CLIC. To this end, a broad R&D program on new silicon detector technologies is currently pursued. While the silicon pixel R&D for the CLIC vertex detector and tracker covers a wide range of various technologies and the development of different tools, this contribution is mainly focussed on the development of monolithic CMOS sensors with a small collection electrode.

拟议的未来紧凑型线性对撞机（CLIC）的物理目标对探测器系统的性能提出了挑战性的要求。顶点和跟踪检测器需要具有几纳秒分辨率的精确命中时间标记，并且每层质量非常低，并且单平面空间分辨率只有几微米。为了满足这些要求，CLIC预计将采用全硅顶点和跟踪系统。为此，目前正在寻求有关新型硅检测器技术的广泛研发计划。尽管用于CLIC顶点检测器和跟踪器的硅像素研发涵盖了广泛的各种技术和不同工具的开发，但这一贡献主要集中在具有小收集电极的单片CMOS传感器的开发上。