Thermoplastic welding, tape placement, 3D printing, overmoulding or even thermostamping involve adhesion of thermoplastic polymer at high temperature. Build-up of the mechanical resistance between two substrates is usually assumed to be driven by the diffusion of macromolecules at the interface, called healing phenomenon. Moreover, in continuous processes, such as some used in manufacturing of composites for aerospace structures, cycles are very short. Thus, there is a need for quantifying the adhesion of such materials especially when processed for short durations. With this aim, a temperature and pressure controlled welding bench was designed to enable the welding of double cantilever beam samples for short time (down to 1 s). Adhesion of a carbon-PEKK composite was characterized over a wide range of residence times ranging from 1 s to 1 h. Three bonding regimes were observed, corresponding to different stages of the adhesion build-up at the interface. Finally, the healing kinetics was identified.

热塑性焊接，胶带放置，3D打印，包覆成型甚至热压涉及热塑性聚合物在高温下的粘合。通常认为两个基材之间的机械阻力的建立是由大分子在界面上的扩散所驱动的，这称为愈合现象。此外，在连续过程中，例如某些用于制造航空航天结构复合材料的过程，周期非常短。因此，需要量化这种材料的粘附力，尤其是在短时间加工时。为此目的，设计了一个温度和压力可控的焊接台，可以在短时间内（低至1 s）焊接双悬臂梁样品。碳-PEKK复合材料的附着力在1 s至1 h的宽范围停留时间内得以表征。观察到三种结合方式，分别对应于界面上附着建立的不同阶段。最后，确定了愈合动力学。