A low-loss fan-out wafer-level package (FOWLP) has been proposed for millimeter-wave application. To ensure the radio frequency (RF) signal transition in a ground–signal–ground (GSG) configuration, the signal structure in the redistribution layer (RDL) is tightly surrounded by its ground. Over a wideband, the proposed RDL structure results in a low loss and a good match at the RF port. Moreover, an efficient measurement methodology has been proposed for the millimeter-wave package. By adopting a 50- $\Omega $ ceramic coplanar waveguide (CPW), performance of the millimeter-wave package is assessed by probes. This measurement method features quite a low measurement error because insertion loss of the added ceramic CPW is very small. By the proposed cascade de-embedding method, the parasitic effects resulting from the interconnections can be removed and the package performance can be achieved. The measured insertion loss for the proposed package is around 1 dB and the measured 10-dB return loss bandwidth is from 70 to 85 GHz.

中文翻译：

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具有新型重分布层图案的低损耗扇出晶圆级封装及其在毫米波应用中的测量方法

已经提出了一种用于毫米波应用的低损耗扇出晶圆级封装（FOWLP）。为了确保射频（RF）信号在地-信号-地（GSG）配置中转换，重新分布层（RDL）中的信号结构被其地紧密围绕。在宽带上，建议的RDL结构可在RF端口上实现低损耗和良好匹配。而且，已经提出了用于毫米波封装的有效测量方法。通过采用50- $ \ Omega $ 陶瓷共面波导（CPW），毫米波封装的性能由探头评估。由于添加的陶瓷CPW的插入损耗非常小，因此该测量方法的测量误差非常低。通过提出的级联去嵌入方法，可以消除由互连引起的寄生效应，并可以实现封装性能。对于建议的封装，测得的插入损耗约为1 dB，测得的10 dB回波损耗带宽为70至85 GHz。