Abstract The Sn-3.0Ag-0.5Cu (SAC305) composite solder reinforced micro-sized silicon carbide and nickel-coated silicon carbide (Ni-SiC) particles were produced by a high-energy ball milling process. SiC and Ni-SiC were homogeneously mixed into SAC305 lead-free solder alloy with distinctive (0.5, 1.0, and 1.5 wt.%) percent weight, through a powder metallurgy path. The growth of nickel on ceramic SiC (1-3 μm) particles was investigated by the electroless nickel (EN) method. The relative contact perimeter (RCP) and the wettability of SAC305 composite solder were investigated with the an image analysis software. The data from image analysis software shows that the relative contact perimeter, as well as the wettability of lead-free composite solders, were significantly improved.

中文翻译：

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陶瓷增强材料和无铅焊料基质之间界面的表征

摘要 采用高能球磨工艺制备了Sn-3.0Ag-0.5Cu（SAC305）复合焊料增强微尺寸碳化硅和镍包碳化硅（Ni-SiC）颗粒。通过粉末冶金路径，将 SiC 和 Ni-SiC 均匀混合到 SAC305 无铅焊料合金中，重量百分比各不相同（0.5、1.0 和 1.5%）。通过化学镀镍 (EN) 方法研究了镍在陶瓷 SiC (1-3 μm) 颗粒上的生长。使用图像分析软件研究了 SAC305 复合焊料的相对接触周长 (RCP) 和润湿性。来自图像分析软件的数据显示，相对接触周长以及无铅复合焊料的润湿性得到显着改善。