Abstract The joints with Cu and Al as base materials were brazed by a new BAl88Si filler metal. By using the field emission scanning electron microscope, energy spectrum analyzer and transmission electron microscope (TEM), the three-dimensional morphologies of intermetallic compounds in the brazed joint of filler metal were studied, and the lattice mismatch degree of each IMC interface was emphatically analyzed. The results show that the brazed joint of the filler metal has achieved good metallurgical bonding, and the interface micro structure of the Cu/BAl88Si/Al joint is Cu/Cu9Al4+CuAl2+CuAl2+ CuAl2-a-Al eutectic + α-Al/Al. Among them, Cu/Cu9Al4 has the best lattice matching, and it is a complete semi-coherent crystal plane. The interface of Cu9Al4/CuAl2 is a complete non-coherent crystal surface without. Based on the thermodynamic analysis, the formation and growth sequence of the intermetallic compounds in the brazing process was divided into four stages, and the formation of CuAl2 in the brazing seam was firstly confirmed by Gibbs free energy, followed by the formation of Cu9Al4.

中文翻译：

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BAl88Si钎料钎焊Cu/Al接头界面组织及生长机制

摘要 采用新型BAl88Si钎料钎焊以Cu和Al为基材的接头。利用场发射扫描电子显微镜、能谱分析仪和透射电子显微镜(TEM)，研究了钎焊接头中金属间化合物的三维形貌，重点分析了各IMC界面的晶格失配程度. 结果表明,钎料钎焊接头实现了良好的冶金结合,Cu/BAl88Si/Al接头界面显微组织为Cu/Cu9Al4+CuAl2+CuAl2+CuAl2-a-Al共晶+α-Al/Al . 其中Cu/Cu9Al4晶格匹配最好，是完整的半相干晶面。Cu9Al4/CuAl2 的界面是一个完整的非相干晶体表面，没有。根据热力学分析，